第三代
            半導(dǎo)體測試家族
            Third generation semiconductor testing family
             
        
        
    
             
             
     
    
            
    
             
            
        
              
        
           
             
        
                         
               
        
                
                
                
        
            
    
            
      
     
    
    
             
            
            
            
                  
            
                       
                       
              
                          
                                             
                       
     
                          
                          
                       
            
           
                 
            
                 
            
           
                
                   

            
    
            
             
                       
                        
            
                            
            
                                
            
                                    
            
                                    
                                                        
                                                    
                        
                                 
                
                
                
                
                                        
                                                   
                                    
            
                                    
            
                                    
            
                                    
            
                                
            
                            
            
                            
            
                                                        
                            
                            
                            
             
                        
            
             
            
             
            
                    
            
                             
            Double loading fully automatic marking machine
            
                             
            It is suitable for trough type and stacked magazine turnover, and is an equipment for various laser printing before and after IC lead frame packaging; the equipment consists of two automatic loading and unloading mechanisms, a sheet pushing mechanism, a s
            
                             
             


            

            

            
	
		
            
			
				
            
					 
				
            
				
            
					Suspended power supply
				
            
			            		
			
				
            
					 
				
            
				
            
					Multiple sites in parallel
				
            
			            		
			
				
            
					 
				
            
				
            
					Multi-channel high precision
				
            
			            		
			
				
            
					 
				
            
				
            
					Supports multiple extensions
				
            
			            		
		
            
	            

            
                             
            
                             
            
                                                          
            
                    
            
             
            
    
              
    
            
    

            
	
		
            
			
				Model 
			
			
				Double loading fully automatic marking machine
			
		
            
		
            
			
				Product introduction 
			
			
				It is suitable for trough type and stacked magazine turnover, and is an equipment for various laser printing before and after IC lead frame packaging; the equipment consists of two automatic loading and unloading mechanisms, a sheet pushing mechanism, a sheet conveying mechanism, a direction detection component, and a two-dimensional It consists of code reading, VISION positioning, double-head laser marking machine, printing detection component, NG collection mechanism, etc. Through parameter adjustment, it can be applied to various IC lead frames of different lengths and widths. 
            
			            		
		
            
		
            
			
				Features 
			
			
				? This device has the characteristics of large printing range, strong compatibility, high printing accuracy, fast speed and good stability
            
      ? Suitable for marking blanks in TO, BGA, SOP, QFN, SOT, SOD and other packaging forms
            
			            		
		
            
	            

            

            
                        
            

   
    
               
  
                
                
    
            
    
    
    
    
    
    
            
        
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